On the morning of August 8, 2024, the inauguration ceremony for Jiangsu Xinmeng's TSV Advanced Packaging R&D Center (hereinafter referred to as the "R&D Center") was grandly held at the Zhongwu Runjin Advanced Manufacturing Industrial Park. Distinguished guests attending the ceremony included Huang Naihong, Standing Committee Member of Wuzhong District Committee and Executive Deputy District Mayor; Wang Xiaolan, Committee Member of the Party Working Committee and Deputy Director of the Management Committee of Wuzhong Economic and Technological Development Zone; as well as leaders from the Wuzhong District Development and Reform Commission, Industry and Information Technology Bureau, Science and Technology Bureau, Emergency Management Bureau, Ecology and Environment Bureau, and Fire Rescue Brigade. Additionally, the ceremony was attended by leaders from the Investment Promotion Bureau, Industrial Development Bureau, Science and Technology Innovation Bureau, and Safety and Environment Bureau of Wuzhong Economic Development Zone, along with Liao Zhoufang, General Manager of Jiangsu Xinmeng, and the senior management team.

Speech Session

Sun Bin, head of the R&D Center, first extended a warm welcome and sincere gratitude to the leaders and guests attending the ceremony, and introduced the construction background and future plans of the R&D Center. He stated that the R&D Center was established with the support of leaders and colleagues from all sectors. Jiangsu Xinmeng will fully commit to completing customers' testing tasks and dedicate itself to resolving key technical challenges in the industry through independent research and development, promoting technological innovation and industrial upgrading. The center aims to become an influential scientific research platform in the industry, contributing to customer service, technological innovation, and industrial development.

Wang Xiaolan, Deputy Director of the Management Committee of Wuzhong Economic and Technological Development Zone, congratulated the establishment of the R&D Center on behalf of the Party Working Committee and Management Committee of Suzhou Wuzhong Economic Development Zone, and highly praised Jiangsu Xinmeng's technological R&D capabilities and its role in promoting industrial development. She stated that the semiconductor industry is a key development direction for Wuzhong Economic Development Zone, which has formed a complete industrial chain covering multiple segments and continuously attracted and cultivated a number of outstanding enterprises represented by Jiangsu Xinmeng. Wuzhong Economic Development Zone will continue to support Jiangsu Xinmeng's development and promote more enterprises to take root in Wuzhong and thrive.

Liao Zhoufang, General Manager of Jiangsu Xinmeng, stated in his speech that looking back on the development process of the entire R&D center project, from project initiation, site selection, construction, to completion and today's official operation, every step has embodied the hard work and dedication of many people. He expressed gratitude to the government, construction units, partners, and all colleagues of Xinmeng for their full support to the company's development. The R&D Center is committed to becoming an industry leader in domestic advanced packaging vertical interconnection technology and equipment industrialization. We believe it will bring broader market prospects and higher economic benefits to the industry.

Inauguration Ceremony

Huang Naihong, Executive Deputy District Mayor of Wuzhong District, and Liao Zhoufang, General Manager of Jiangsu Xinmeng, jointly unveiled the red silk covering the nameplate.This marks the official operation of Jiangsu Xinmeng's TSV Advanced Packaging R&D Center, symbolizing another solid step forward for Jiangsu Xinmeng on the path of technological innovation, and reflecting the great strategic layout of Wuzhong District in cultivating industrial clusters. Starting from this new beginning, Jiangsu Xinmeng will demonstrate new achievements, boost further upgrades in the semiconductor field in Wuzhong, and inject new vitality into the industry's development.

After the ceremony, accompanied by Liao Zhoufang, General Manager of Jiangsu Xinmeng, and relevant responsible persons, the attending guests visited the R&D Center. Staff members詳細介紹 introduced the company's latest technological achievements. Everyone engaged in in-depth exchanges on the R&D Center's research directions, technical advantages, and impact on industry development, and highly recognized Jiangsu Xinmeng's technical strength and development prospects in the semiconductor industry.

Jiangsu Xinmeng has always been committed to providing comprehensive solutions for high-end wet process equipment and technologies in integrated circuit manufacturing, advanced packaging, and substrate manufacturing for the semiconductor industry. The official establishment of this R&D Center will become an important base for the company's technological innovation, attracting and cultivating more outstanding talents, and providing strong support for the company's long-term development. In the future, the company will continue to adhere to its corporate values of service, innovation, struggle, sharing, and unity, unwaveringly increase R&D investment, promote technological innovation, and continuously improve product and service quality. We look forward to working hand in hand with all partners to create a more brilliant future together!

About Jiangsu Xinmeng TSV Advanced Packaging R&D Center

The Jiangsu Xinmeng TSV Advanced Packaging R&D Center is meticulously built by Jiangsu Xinmeng Semiconductor Equipment Co., Ltd. Focusing on horizontal electrochemical deposition process and guided by independent R&D, the center constructs a full-process flow testing platform for the advanced packaging industry, committed to becoming an industry leader in domestic advanced packaging vertical interconnection technology and equipment industrialization. The center has a total area of 1,232.8 m2 and features both Class 1,000 and Class 100 clean testing environments. It is equipped with self-developed and produced Xtrim-ECD plating equipment and a full set of main process equipment for advanced packaging including coating, exposure, development, and etching, enabling sample testing for plating processes such as RDL, Bumping, and TSV in advanced packaging. It is also equipped with Xtrim-FC wafer cassette cleaning, Xtrim-SC-CL cleaning, Xtrim-SC-BR brushing, Xtrim-SC-ET etching, Xtrim-SC-BE backside corrosion, and other equipment, capable of meeting the new technology development testing needs for various products and customer sample requests.

About Jiangsu Xinmeng Semiconductor Equipment Co., Ltd.

Jiangsu Xinmeng Semiconductor Equipment Co., Ltd. is committed to providing comprehensive solutions for high-end wet process equipment and technologies in integrated circuit manufacturing, advanced packaging, and substrate manufacturing. Its main products include fully automated wafer-level electroless plating equipment, fully automated single-wafer cleaning equipment, fully automated FOUP cleaning equipment, high aspect ratio TSV microvia filling equipment, etc. Jiangsu Xinmeng始終堅持 adheres to innovation leadership, continuously overcoming innovative product technologies. The company's self-developed domestic first fully automated electroless plating equipment was rated as a major equipment in the first batch of Su-Xi-Chang region, currently holding the top market share domestically; its self-developed fully automated FOUP cleaning equipment successfully broke foreign monopoly and has entered applications in leading domestic semiconductor companies. Jiangsu Xinmeng has accumulated numerous honors and qualifications including National High-tech Enterprise, Jiangsu Provincial Double-Talent, Jiangsu Potential Unicorn, Jiangsu Provincial Specialized, Refined, Unique, and Innovative SME, Jiangsu Provincial Enterprise Engineering Technology Research Center, Suzhou Gazelle Enterprise, Suzhou Unicorn Incubation Enterprise, etc.